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US 06231427
   Retaining ring for CMP
US 06231427
   CMP system with fluid bearing support
US 06231427
   Linear polisher for CMP
US 06159083
   Polishing head for CMP
US 06149512
   Linear pad conditioning apparatus
US 06126527
   Seal for polishing belt center support
US 06086456
   CMP hydrostatic fluid bearing support
US 06062959
   CMP hydrostatic fluid bearing support
US 06042457
   Conditioner assembly for CMP process
US 06000997
   Temperature regulation in a CMP process
US 05980368
   Sealed fluid chamber for CMP
US 05957764
   Modular wafer polishing apparatus
US 05947802
   Wafer shuttle system
US 05935768
   Thermal module for photolithography
US 05803799
   Wafer polishing head
US 05800248
   Control of CMP rate across a wafer
US 05692947
   Linear polisher for wafer planarization
US 05651823
   Clustered photolithography system
US 05593344
   Fluid bearings and drive systems for CMP
US 05575707
   Polishing pad cluster for CMP
US 05571044
   Wafer holder for CMP
US 05558568
   CMP with fluid bearings
US 05553994
   Substrate coat/develop system
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